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Screen printing lines・8-inch wafer solder bump printer

Features of 8-inch wafer solder bump printer


A fully automatic cassette-to-cassette type screen printer for wafers that supports various wafer sizes.
A cassette (corresponding to each standard) is loaded on the loader, automatically taken out by the horizontal transfer robot arm, printed after pre-alignment (notch detection), and stored in the cassette again. Printing of solder bumps and polyimide coverings can be performed with high accuracy and fully automatically. FFU can be installed as an option.

Application example
  • Electronic components
  • Solar cell
  • Touch panel
  • Film device
  • Car parts
  • Fuel cell
  • Semiconductor

Basic specifications of 8-inch wafer solder bump printer

Print size 8-inch wafer, 6-inch wafer
Frame size External dimensions 550 mm x 650 mm
Image recognition for printer unit
(Binarization / pattern matching)
Alignment method Alignment accuracy ±10μm
Screen size 550 mm × 650 mm
Squeegee printing pressure control Vertical air balance system
Squeegee drive ULVD (Ultra Low Vibration Drive) system (PAT.P)

With pre-contact squeegee standard equipment (PAT.P)

Example of solder bump printing


We accept various options and modifications
according to the application and budget.
Please feel free to contact us
about screen printing machines.