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  • Micro-Squeegee
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  • Print related materials
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♦ 8inch wafer solder bump printer MT-80SP
MTP-2000 | MTP-700 |
Reel-to-reel film | Reel to reel | In-line systems |
MPV-2400 | MPV-1400 | MPV-500 |
| Solder bump printing | For LCD | For bigger glass |
Solder bump printing in-line system for 8inch wafer.
Loader and unloader section F8 inch wafer Double cassette for pick and place by robot arm (Printed wafer returns to the cassette).

MT-80SP Standard specification
Printing area 8 inch wafer and 6 inch wafer
Screen frame size 550 mm x 650 mm(outside)
Printer section Vision system (Binary search / Pattern matching)
Positioning accuracy ±10μm
Screen size 550 mm x 650 mm
Printing pressure control Vertical air balance system
Squeegee drive ULVD (Ultra Low Vibration Drive) system (PAT.P)
Pre-contact squeegee (PAT.P)
**For customers OEM requirement we can help to select optional items and right modifications. Please access us once from our Inquiry Form in the 'CONTACT'.
Test printing is possible if you bring the screen mask, paste and substrate at Micro-tec's Urayasu office and Niigata factory.