• MT-80SP
Solder bump printing in-line system for 8inch wafer.
Loader and unloader section F8 inch wafer Double cassette for pick and place by robot arm (Printed wafer returns to the cassette).

MT-80SP Standard specification
Printing area 8 inch wafer and 6 inch wafer
Screen frame size 550 mm x 650 mm(outside)
Printer section Vision system (Binary search / Pattern matching)
Positioning accuracy 10µm
Screen size 550 mm x 650 mm
Printing pressure control Vertical air balance system
Squeegee drive ULVD (Ultra Low Vibration Drive) system (PAT.P)
Pre-contact squeegee (PAT.P)
close