Solder bump printing in-line system for 8inch wafer.
Loader and unloader section F8 inch wafer Double cassette for pick and place
by robot arm (Printed wafer returns to the cassette).
MT-80SP Standard specification
Printing area
8 inch wafer and 6 inch wafer
Screen frame size
550 mm x 650 mm(outside)
Printer section Vision system (Binary search / Pattern matching)